BEYOND CITY COLLEGES OF CHICAGO, DOES CHA OFFER SCHOLARSHIPS TO 2 & 4 YEAR COLLEGES? 

The 2017-2018 CHA Scholarship Application will open January 17th 2017!  

  • The application was open from January 17th 2017 to May 17th 2017.
  • Award notifications will be sent out via email by July 7th 2017.
  • While the application is closed, you can still access your scholarship account and view your application status, click here.

FOR CHA RESIDENTS

The college scholarship program is only for current residents of the Chicago Housing Authority (CHA) currently listed on a CHA lease. The applicant must plan to enroll in an accredited post-secondary institution in the fall of 2017. Accordingly, applicants can include current high school seniors, undergraduate and graduate students continuing their studies, or adults seeking to start a post-secondary program in the fall of 2017.  Scholarships cannot be applied to any past debt with your institution. Proof of enrollment will be required at the time of scholarship award.

FOR STUDENT SUCCESS

CHA plans to award over 200 scholarships ranging from $1,000 to $2,500 based on each applicant’s academic merit, community involvement and essay content. A 2.5 GPA or higher is recommended for all applicants. If you have previously received an award through this program and will be continuing your studies in the fall, you will need to reapply in order to receive sustained support.

PLEASE NOTE

If you are enrolled or plan to enroll in one of the Chicago City Colleges, CHA has a separate partnership directly with City Colleges that will allow CHA residents to attend their colleges for little or no cost, after financial aid is applied. Due to this special agreement, CHA residents attending one of the City Colleges of Chicago are not eligible to receive the CHA Scholarship and need not apply. If you would like further information on CHA’s partnership with Chicago City Colleges, please click here.

For questions about the CHA Scholarship, please email education@thecha.org or call 312.786.3222.